Heraeus

Heraeus is a leading technology group headquartered in Hanau, Germany. Heraeus creates high-quality solutions for customers our customers and strengthen their long-term competitiveness by combining material expertise with technological know-how. Their portfolio ranges from components to coordinated material systems which are used in a wide variety of industries, including the steel, electronics, chemical, automotive and telecommunications industries.

Bergquist

Innovation, performance and customer satisfaction are Bergquist's guiding principles. Today, Bergquist supplies the world with some of the best-known brands in the business: Sil-Pad thermally conductive interface materials, Gap Pad electrically insulating and non-insulating gap fillers, Hi-Flow phase change grease replacement materials, Bond-Ply thermally conductive adhesive tapes, and Thermal Clad insulated metal substrates.

Jemic

JEMIC Shielding Technology manufactures and distributes electromagnetic interference (EMI) shielding products. Our EMI gaskets control undesired electromagnetic energy and radio frequency interference (RFI) from disrupting or radiating from electronic devices.

Our EMI shielding product lines consist of fabric-over-foam EMI profile gaskets, EMI shielding tapes, fabric-over-foam I/O backplane gaskets, EMI cable shielding, andEMI shielding laminates.

Our electronic shielding services include design consultation, prototyping and testing. All of our EMI gaskets are available in custom shapes, sizes and configurations.

Our manufacturing lines and processes were developed to offer flexible product designs in both low and high volume runs.

Technomelt

Technomelt is widely recognized as an industry leader in low-pressure molding compounds.

These thermoplastic hotmelts use extremely low pressure to effectively encapsulate even the most delicate circuitry. Technomelt cycle time is fast and processing temperatures are a modest 130 to 240°C, with in-use temperatures ranging from –40 to +140°C. As compared to traditional potting and encapsulating processes, Technomelt is superior, offering short cycle times, low-pressure molding and maximum yield with minimal material waste, without damaging delicate circuitry.

Technomelt low-pressure molding occupies the niche between injection molding and potting. It is basically injection molding at very low pressures with hotmelt adhesives. The process is fast, simple and clean: just insert electronics, overmold, and test.