Lord specializes in developing world-class thermal management, potting and encapsulation, gap filling, semiconductor packing, adhesive and thick film materials for demanding applications. Their experience in electronic materials spans more than 50 years, and they incorporate this vast knowledge in developing solutions for new applications to help ensure customers' success.

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  • Chemlok ©
  • CoolTherm ©


  • Gap Fillers
  • Potting & Encapsulation
  • Semicon Packaging & Circuit Assembly
  • Structural Adhesives
  • Thick Film Materials
  • Thermal Management Materials (TIM)