Technomelt

Technomelt is widely recognized as an industry leader in low-pressure molding compounds.

These thermoplastic hotmelts use extremely low pressure to effectively encapsulate even the most delicate circuitry. Technomelt cycle time is fast and processing temperatures are a modest 130 to 240°C, with in-use temperatures ranging from –40 to +140°C. As compared to traditional potting and encapsulating processes, Technomelt is superior, offering short cycle times, low-pressure molding and maximum yield with minimal material waste, without damaging delicate circuitry.

Technomelt low-pressure molding occupies the niche between injection molding and potting. It is basically injection molding at very low pressures with hotmelt adhesives. The process is fast, simple and clean: just insert electronics, overmold, and test.

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Products

  • Macromelt® OM (Polyamide)
  • Macromelt® Q (Polyolefin)
  • Macroplast® QR (Reactive Polyurethane)

Applications

  • PCB Encapsulation
  • Sensors and Switches
  • Inductive Elements
  • Connectors
  • Watertight Sealing
  • Strain Relief
  • Battery Molding for Mobile Devices 

Smiths Connector

Smith Connectors is a leading provider of spring contact probe based technologies, including connectors, advanced semiconductor test sockets, ATE interfaces and spring contact probes. IDI was acquired by Smiths in 2010.

IDI spring probe technology provides test engineers and product designers with the reliability they demand. For over three decades, test engineers and product designers have turned to IDI for the most reliable interconnect designs available, be it for military, aerospace, medical, homeland security and industrial markets, with high reliability.

IDI is the originator of the spring contact probe test socket and continues to be the leader of innovations in the semiconductor test industry with their test sockets.

Smith Connectors is the leading manufacturer of high performance test solutions for virtually any Semiconductor packages or In-Circuit Test pins and interconnect applications. Designs are based on proprietary technologies that ensures:

  • high cycle life
  • Constant contact resistance
  • Acceptance of high bandwidth requirements
  • Easy maintenance
  • Suitability for all packages

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Products

  • Test Sockets (CSP, BGA, LGA, PoP, WLCSP, QFN, etc.)
  • Manual Lids (Clamshell, VCC, Clip-on, etc.)
  • Semiconductor Probes
  • Spring Contact Probes

Applications

  • IC Testing
  • PCB Testing

Emerson & Cuming

Emerson & Cuming is a world leader in the design and manufacture of high performance polymers for the most challenging circuit and component assembly applications.

With quality and reliability as the foundation of every formulation, Emerson & Cuming materials from Henkel are an integral part of manufacturing operations around the globe, serving customers in markets that include automotive, consumer, digital printing, displays, handheld communications, industrial electronics and RFID, among others.

logo emerson  img emerson

Products

  • EccobondTM
  • EccocoatTM
  • EccosealTM
  • StycastTM
  • AblebondTM
  • AbleFilmTM
  • AquadagTM
  • ElectrodagTM

Applications

  • Encapsulants for electronics
  • Electrical interconnect
  • Conformal coating
  • Electrically conductive adhesives / coatings
  • Die-attach adhesives
  • Film adhesives